Used ACCRETECH A-WD-200T for sale by Tanaka Corporation | used-line.com
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HOME Semi & SMT/PCB Semi & SMT/PCB Dicing Saws ACCRETECH A-WD-200T

ACCRETECH A-WD-200T

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  • $34600

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Flag of JapanEquipment Location: Japan      
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Description of ACCRETECH A-WD-200T

Categories: Semi & SMT/PCB, Dicing Saws

Condition: Used

Seller: Tanaka Corporation

#06704 ACCRETECH Full-Automatic Wafer Dicing Machine A-WD-200T

  • Acceptable wafer size : φ1" to φ8" for circle wafers, ?25mm to ?140mm for square wafers
  • Frame size : φ5" to φ8"
  • Spindle : air-spindle with DC brush-less motor, 1000 to 6000/min. as rotation (20000 to 60000 as input range), 1,2kw as maximum output,  water cooling with flow sensor, φ2" as blade size (φ3"adjustable)
  • Dicing stroke for X axis : 250mm (about 7")
  • Dicing stroke for Y 1 axis and Y 2 axis : 250mm (about 7")
  • Dicing stroke for Z 1 axis and Z 2 Axis : 35mm (about 1")
  • Spinning range for θ axis : 380"
  • Microscope : switchable in 2 steps, high magnification and low magnification 
  • Aliment : pattern matching 
Mandatory utilities to operate
  • Power supply : AC 200V ± 10%
  • Air source : 0.5 to 0.7MPa (250L/min.)
  • N2 : 0.5 to 0.7Mpa (100l/min.)
  • Cooling water for spindle : 0.2 to 0.5MPa (3.0L/min.)
  • Dicing water : 0.4 to 0.5 MPa (MAX. 12L/min.)
  • Rinse : 0.4 to 0.5MPa (MAX. 5L/min.)
  • Exhaust ventilation : more than 5m3/min.
  • Dimension : W1240 x D1240 x H 1350mm (about w4.1ft x D4.1ft x 4.5ft) without display monitor and other protruding objects
  • Weight : approx. 1450kg (about 3200lb)

 

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